TGV and RDL process enables sub-20 μm vias, symmetric stack-ups and low-loss substrates for AI, HPC and optical modules. PCBAIR announced the launch of its advanced 8-layer Glass Core PCB ...
Nvidia approves Samsung's 8-layer HBM3E chips as the graphics giant races to close gap with SK Hynix
Why it matters: HBM3E chips are projected to become a market staple, with demand expected to surge through 2027. Growth will be fueled by generative AI and high-performance computing, both of which ...
HBM scaling is running into physical limitations. More bandwidth translates into higher area and capacity costs. AI demand is intensifying the DRAM shortage. DRAM is under stress, and the fallout is ...
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